As demand for increased power density grows, Accelevation is ready with Direct Liquid to Chip infrastructure and conveyance systems. We are an approved installation partner for multiple DLC Cooling OEMs and can provide installation and integration of DLC in the white space.
evoFRAME System
First of its kind, ground supported infrastructure conveyance system designed with flexibility in mind. The evoFRAME system allows legacy and next generation compute to coexist in the same white space. The system can support air-cooled applications, or can evolve to convey the infrastructure requirements for Direct Liquid to Chip systems to support AI/ML compute applications.
TechFrame
Floor-supported, all-in-one infrastructure support system for conveyance, liquid cooling, containment and cabinet docking. Factory-engineered connections allow for quick-turn design and deployments. Seamless integration with containment doors, panels and seals.
Tech Specs